Background
COMPAL | Intel

Modern Xeon server foundations for AI infrastructure — general-purpose, dense compute, storage, and immersion-ready options.

Contact
Enterprise-grade compute

Enterprise-grade compute

Proven Xeon platform covering enterprise, dense compute, and AI infrastructure

Dense to distributed

Dense to distributed

From compact enterprise footprints to dense multi-node deployments

Thermal paths

Thermal paths

Air to advanced liquid cooling options across the Intel portfolio

OG231-2-L1

Intel® Xeon® 6700P/6500P Series

  • 8× NVIDIA Rubin NVL8 GPUs
  • Up to 400 PFLOPS AI inference
  • Compact 2U direct liquid cooling
OG231-2-L1
MODEL OG231-2-L1
WORKLOAD AI training, inference, and GPU acceleration
FORM FACTOR 2U
PROCESSOR Dual Intel® Xeon® 6700P/6500P Series Processors with P-cores
GPU NVIDIA Rubin GPU
MAX MEMORY 8TB
DRIVE BAY CAPACITY (MAX) 8 x E1.S
COOLING DLC (1-Phase)
MAX POWER(SYSTEM) DC Busbar
RACKSTANDARD EIA 19”

Service

Platform validation and configuration tuning
Rack integration readiness (position as capability)
Cooling advisory: air vs immersion decision support

Get the latest on AI infrastructure

Contact