SD230-8

1, Dual Intel® Xeon® 6 processors, LGA4710 (per node)
2. Easy service – Front access
3. Dynamic PSU redundancy management 
4. Support chassis management

Specifications

CPU

Dual Intel® Xeon® 6700P/6500P Series Processors with P-cores

 
Dimensions

442mm (W) x 850mm (D) x 87.3mm (H)

17.40inch (W) x 33.46inch (D) x 3.44inch (H)

 

Memory (Node)

Memory Type: DDR5 RDIMM (up to 6400 MT/s)
DIMM Slot: 16 DIMM Slots

 

Storage (Node)

Front:

4 * 2.5” SATA/SAS/NVMe U.2 (7mm) 

or

2 * 2.5” SATA/SAS/NVMe U.2 (15mm) 

 

Internal:

2 * M.2 (Type 2280)

 

For U.2 drives:

Intel® Virtual RAID on CPU (VROC) RAID 0, 1, 10, 5

PCIe Slot (Node)

SSD x4:

1 * OCP 3.0

1 * HHHL PCIe Gen5 x16

SSD x2:

1 * OCP 3.0

2 * HHHL PCIe Gen5 x16

 

BMC / CMC

ASPEED AST 2600

ASPEED AST 2620

 

Security (Node)

TPM 2.0 (optional)

PFR 3.0 (optional)

 

Power Supply

1600W 3+1, 2+2, 2+1 Redundant Platinum/Titanium CRPS PSU

2000W 3+1, 2+2, 2+1 Redundant Platinum/Titanium CRPS PSU

I/O Ports (Node)

Front:

•1 * UID Button

•1 * Power Button

•1 * Mini Display port

•2 * USB 3.2 Gen1 ports

•1 * 1GbE Management port

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