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AI infrastructure at rack scale requires systems engineering

Compal designs AI server systems with power delivery, thermal management, and rack integration treated as engineering constraints from day one. Every system is validated and tested before it leaves our facility.

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What we bring to your
AI Infrastructure program

Credentials, capacity, and scale — for programs that cannot afford to fail.

  • 1,000+

    AI Server Engineers

    Engineering Depth

    1,000+

    AI Server Engineers

    • Vertically integrated: compute, thermal & power
    • In-house DLC, immersion, and CDU integration
    • 12MW DLC validation lab. Immersion and failure analysis on site
    • Senior team. Decades in high-density server engineering. Delivered across the programs that define this industry

    Engineering Depth

  • Open

    NVIDIA · AMD · Intel · ASIC

    Platform Breadth

    Open

    NVIDIA · AMD · Intel · ASIC

    • NVIDIA, AMD, and Intel supported
    • Custom ASIC co-design capability
    • Platform selection before BOM lock
    • Architected for your silicon choice. Built to support what comes next

    Platform Breadth

  • PCB–L11

    Full Stack, In-House

    Manufacturing Scale

    PCB–L11

    Full Stack, In-House

    • Automated lines — scalable to hyperscale program volume
    • PCB to rack — Full–L11 build, test, and integration in-house
    • US rack integration (Texas)
    • Liquid leak test, thermal stress, and burn-in on every unit

    Manufacturing Scale

  • 9 Countries

    Built for Continuity

    Global Reach

    9 Countries

    Built for Continuity

    • Vietnam, Taiwan and China — Asia supply and build
    • Texas — US manufacturing and integration hub
    • EMEA-ready for sovereign programs
    • One unified supply chain across PC and server

    Global Reach

  • In-Region

    Faster Turnaround

    Service Speed

    In-Region

    Faster Turnaround

    • In-region failure analysis and repair
    • US-based failure analysis — no cross-ocean RMA
    • In-region support across US, Asia, and EMEA

    Service Speed

  • AI Augmented

    Business Processes

    Intelligence

    AI Augmented

    Business Processes

    • AI-assisted design, simulation, and thermal analysis
    • Automated quality assurance and testing workflows
    • AI-guided manufacturing performance and issue resolution
    • Supply chain and procurement powered by AI agents

    Intelligence

Systems Engineering

Power, thermal, and integration — engineered as one system.

Compute Platform Design

  • NVIDIA HGX™ architecture
  • AMD Instinct architecture
  • Intel Xeon CPU platforms
  • Custom ASIC-ready board architectures
  • Power delivery & signal integrity co-design

Thermal Engineering

  • Cold plate DLC — single-phase (1P)
  • Cold plate DLC — dual-phase (2P)
  • Immersion-ready chassis design
  • Thermal simulation pre-prototype
  • Service access by design

Rack Power Architecture

  • High-density rack power design
  • Architected for HVDC transition
  • Transient and sustained load modelling
  • Redundancy and fault isolation
  • ORv3 and facility interface compliance

Cooling Infrastructure Integration

  • In-rack CDU interface design (supply/return manifold)
  • Row-level / sidecar CDU compatibility
  • N+1 redundancy design for cooling loops
  • CDU management interface (BMC protocol)
  • Compatible with leading CDU providers

L11 Integration & Validation

Rack-level validation at scale. Deployment-ready on arrival.

01

L6–L10 System Build

Board-level to system-level assembly under controlled BOM and change management. Automated SMT lines across global manufacturing footprint.

02

Liquid Leak Test

Full loop leak verification before thermal validation. Documented pass/fail protocol applied to every unit.

03

Thermal & Power Stress

Full-load thermal profiling. Sustained-load power validation under representative rack power conditions. Real-time monitoring of coolant flow rate and manifold distribution.

04

Controlled Burn-In

Extended operational validation under representative workload profiles. Failure isolation completed before shipment.

05

L11 Rack Integration

Compute, cooling, and power integrated as a single validated rack. ORv3 and EIA standards compliant.

06

Deployment Documentation

Full configuration record. Rack-level test reports. Deployment-ready package for customer data center operations team.

Platform &
Ecosystem Openness

Platform-agnostic by design. Ecosystem-ready by validation.

Multi-Silicon Platform Design

Compal platforms are designed across NVIDIA HGX™, AMD Instinct™, and Intel® Xeon® architectures. Platform selection happens at the requirement stage — before silicon is locked.

  • NVIDIA HGX™ architecture
  • AMD Instinct™ architecture
  • Intel® Xeon® CPU platforms
  • Custom ASIC-ready board design

Infrastructure-Agnostic Integration

Our rack systems interface with leading power and cooling infrastructure. We do not require proprietary CDUs or power shelves, we specify the interface and validate against it.

  • Compatible with leading CDU providers
  • HVDC and AC facility interface options
  • Open standard compliance (ORv3, OCP, EIA)
  • No ecosystem lock-in

Early Platform Alignment

Compal engages before silicon is finalized. This allows co-design of the system architecture for your specific workload density and deployment environment, preserving your architecture choices.

  • Requirements alignment before BOM lock
  • Workload-aware thermal modeling
  • Joint validation milestones defined early
  • Architecture flexibility preserved

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