Compal makes a grand debut at CloudFest 2025 (March 17–20, 2025) with the launch of its groundbreaking SG720-2A/OG720-2A AI server—a milestone that marks a major breakthrough in the convergence of high-performance GPU Accelerator and two-phase direct-to-chip(DTC) liquid cooling technology.
The SG720-2A/OG720-2A 7U AI server not only supports 8x AMD Instinct™ MI325X GPUs —built on the advanced CDNA 3 architecture up to 896GB/s Infinity Fabric™ bandwidth, which achieves a theoretical FP16 performance of approximately 20.9 PFLOPs with sparsity and exceeds 41.8 PFLOPs with sparsity in FP8 computations—but also incorporates total 2TB of high-speed HBM3E memory in the platform with up to 48TB/s of memory bandwidth, delivering unparalleled compute power and ultra-fast data access for large-scale AI inference and data processing. Additionally, it is equipped with the ZutaCore® HyperCool® 2-Phase DLC liquid cooling solution, and the synergistic integration of these technologies elevates the SG720-2A/OG720-2A’s performance and operational stability to unprecedented levels.
With an optimized 850mm chassis depth, the SG720-2A/OG720-2A seamlessly integrates into a standard EIA 19" 1-meter-deep rack or Open Rack v3-compatible setup.It enhances power efficiency and simplifies management with front-facing, hot-pluggable I/Os, making it a scalable and high-performance solution for data centers.
Its modular architecture facilitates straightforward maintenance and upgrades, with independent component replacement that minimizes downtime, while hot-swappable PCIe slots offer the crucial advantage of minimizing downtime and maximizing efficiency by allowing for network card replacement or upgrades without shutting down the entire system.
Compal recently conducted an experiment to evaluate the efficiency of direct-to-chip liquid cooling methods, revealing that ZutaCore’s HyperCool technology achieved an impressively low partial Power Usage Effectiveness (pPUE) of 1.01. In comparative testing against single-phase liquid cooling, HyperCool consistently outperformed across all test conditions with 5% lower pPUE, demonstrating its superior efficiency and effectiveness in optimizing thermal management. This benchmark cements HyperCool as a game-changing solution for sustainable, high-performance data centers.
At CloudFest 2025, Compal, in partnership with ZutaCore®, showcases cutting-edge core technologies and solutions for the data centers of the future.In addition to showcasing the all-new SG720-2A/OG720-2A, other leading-edge server technologies are also on display. Interested attendees are warmly invited to visit the exhibit and explore the latest advancements in AI and HPC technologies.
CloudFest 2025 – Compal Booth
đź“… Dates: March 17 – March 20, 2025
đź“Ť Location: Europa-Park, Germany
🔹 Booth number：R07