Compal Electronics (Compal; Stock Ticker: 2324.TW) l leverages Intel Xeon 6 platform to redefine next-generation server solutions, setting new standards in performance, efficiency, and scalability. Designed for AI, HPC, and cloud applications, the latest platform pushes the limits with advanced thermal optimization, comprehensive direct liquid cooling (DLC) support for HPC, and an innovative front I/O design enhances serviceability in cold aisle environments, ensuring maintenance is more efficient and reliable, while maintaining peak performance even under extreme workloads.
Intel Xeon 6 Processors
The Intel Xeon 6 processor series integrates innovative architectures featuring Efficient-cores (E-cores) and Performance-cores (P-cores) to provide optimized performance for diverse workloads.
- Intel Xeon 6 with E-cores: Designed for high-density and scalable cloud environments, supporting up to 144 cores, 8 memory channels, and 88 PCIe 5.0 lanes. It also features Compute Express Link 2.0 (CXL 2.0) for enhanced memory expansion and data access.
- Intel Xeon 6 with P-cores: Optimized for AI and HPC workloads, delivering 2x higher per-core AI inference performance1. Integrated with Intel Advanced Matrix Extensions (Intel AMX), it accelerates FP16, BF16, and INT8 training and inference for NLP, image recognition, and recommendation systems.
Compal's Advanced Server Solutions
Compal provides cutting-edge solutions tailored to the most demanding workloads, ensuring reliability, scalability, and efficiency.
SR130-2 / SR230-2: 1U / 2U 2P General-Purpose Server Platform
The SR130-2 / SR230-2 is a high-performance, scalable server platform supporting up to 144-core Intel Xeon 6 processors, delivering up to 2.2x AI inference performance improvement¹.
- High turbo frequency enhances AI model training efficiency.
- Up to 336MB L3 cache ensures ultra-low latency and rapid database access for faster workloads.
- Ideal for enterprise AI, data analytics, and virtualization applications, offering superior processing power and adaptability.
SD230-8: 2U 4-Node High-Density Server Platform
Designed for high-density computing, the SD230-8 maximizes rack space utilization and provides industry-leading performance for HPC and AI workloads. With intelligent dynamic PSU redundancy, comprehensive DLC configuration support, and an innovative front I/O design for easy maintenance, SD230-8 system ensures optimal power efficiency, seamless scalability, and enhanced cold aisle serviceability for maximum data center performance and reliability
- Up to 1.54 x HPC performance improvement for large-scale computing demands¹.
- Equipped with Intel AMX, optimizing deep learning and inference, particularly for NLP, recommendation systems, and image recognition.
- Perfectly suited for AI, HPC, and cloud infrastructure, optimizes power efficiency, enhances scalability, and streamlines serviceability—delivering exceptional reliability and performance for mission-critical, high-computing workloads.
Compal’s Expertise in Secure and Cloud-Optimized Computing
Compal’s server platforms integrate Intel Software Guard Extensions (Intel SGX) for application-level isolation and Intel Trust Domain Extensions (Intel TDX) for VM-level confidential computing, helping to ensure robust security in multi-cloud environments. With our extensive R&D expertise, we design solutions that optimize workload deployment and enhance overall computational efficiency.
Driving the Future of AI and High-Performance Computing
With Intel Xeon 6 processors at the core of our latest server platforms, Compal is at the forefront of AI, HPC, and cloud innovation. Our advanced server solutions empower enterprises to scale operations, enhance computational efficiency, and stay ahead in the digital transformation era.
1. See intel.com/processorclaims: Intel® Xeon® 6. Results may vary.